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What is a SOIC package?

What is a SOIC package?

The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. Standard Pb-free lead finish on these packages is Matte Tin plating.

What is SOP package in IC?

Small Out-Line Package IC Also refer to a PSOP, a plastic SOP, again a much smaller IC with fewer pins. The term Small-Outline normally just means that the package is thinner than a pre-existing package style. The term doesn’t define the type of leads or terminals used with the package.

What are J leads?

“J” Lead Packages have termination leads that are formed into a J pattern, with the lead’s tail folding up and under the package body (instead of flat and outwards like a “Gull-wing”). “J” leaded terminations are considered to be the second most reliable termination style of the leaded SMT devices.

What is the difference between SOIC and TSSOP?

The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product. The lead pitch is much closer (almost half) on the TSSOP- 0.65mm vs. 1.27mm, so for crude manufacturing processes the SOIC might well be preferred.

Is SOP and SOIC the same?

Another name of SOP is called SOIC, JEDEC standard are called SOIC in the United States, and JEITA standard one is called SOP in Japan, and the body width of the former one is larger than the latter. It was developed to reduce space required on the substrate more than DIP.

What is SMD and BGA?

A ball grid array (BGA) is a type of surface-mount packaging. BGAs are used for integrated circuits, specifically for SMDs like microprocessors which require permanent mounting. Though it is a type of SMT, the ball grid array uses a different approach to connections.

What is SSOP package?

The Shrink Small Outline Package , or SSOP, is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch. SSOP lead counts range from 8 to 64. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1.65 mm to 1.85 mm.

How do you solder J lead?

Procedure

  1. Add liquid flux to the corner pads.
  2. Place the component in position and hold it steady.
  3. Place the soldering iron tip at the junction between the pad and component lead at one of the corners.
  4. Remove the tip.
  5. After the opposite corner is soldered, solder the remaining leads.
  6. Clean, if required and inspect.

What are IC leads made of?

Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic.

What are IC packages made of?

The materials of the package are either plastic (thermoset or thermoplastic), metal (commonly Kovar) or ceramic. A common plastic used for this is epoxy-cresol-novolak (ECN). All three material types offer usable mechanical strength, moisture and heat resistance.

How is IC classified?

Integrated circuits can be broadly classified into analog, digital and mixed signal, consisting of analog and digital signaling on the same IC. Digital integrated circuits can contain billions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters.

What is the difference between SSOP and Tssop?

SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package. TSSOP package having an encapsulant width less than 300mils covering entire package, having total height less than 1.2mm, said package named Thin Shrink Small Outline Package.

What does Tssop stand for?

The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

What is SMD vs SMT?

The difference between SMD and SMT is that SMD (surface mount device) refers to an electronic component mounted on a PCB. In contrast, SMT (surface mount technology) relates to the method used to place electronic components on a printed circuit board.

What is SMT line?

SMT lines or SMT production lines refer to the manufacturing facilities for PCB assembly and testing. Each process in SMT production has different flows and requirements, for which different processing machines and postitions cooperate to form a complete SMT line.

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